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Partners Articles

12/18/07Addressing low-power issues in chip design
10/24/07CPF-Based, Low-Power Digital Reference Flow
04/06/07Women of Distinction Awards Pay Tribute to Some of Silicon Valley's Most Powerful and Inspiring Women
04/06/07Winner: Jan Willis
01/12/07Si2 approves low-power spec, seeks 'convergence'
11/05/06Pushing Power Forward with a Common Power Format
09/05/06Cadence moves to broaden power initiative
05/25/06TSMC, UMC Ready for 65-nm X Architecture Designs
05/22/06Initiative Seeks Common IC Power Format
05/22/06Cadence Led Initiative Seeks Low Power Standard
05/22/06Standard Format to Automate Low Power IC Design
03/24/06Fueling Innovation with Vertical Re-aggregation
03/07/06Si2 Releases Current-source Model Standard for Design Libraries
02/28/06Silicon Design Chain - Second Power Management Methodology
02/08/06Innovators of Electronic Design Honored
01/19/06Global Designer: IEEE Standardizes SystemVerilog
01/12/06Cadence Claims X Architecture Boosts Net Good Die Per Wafer by a Minimum of 10%
12/05/05Open-source Database Links Today's Hodgepodge of Tools
12/01/05Virtual vs Vertical - How will DFM Change the Foundries?
11/11/05OpenAccess Simplifies Chip Makers' Lives
11/11/05Freescale, Cadence Said to be Seeking Deal to Cut EDA Costs
11/07/05OpenAccess Effort Has Momentum
11/04/05Panelists Optimistic on Lower Power Design
11/04/05Panelists Ponder Challenges of 45nm
11/04/05Panel Studies Power on SoCs
10/06/05Cadence, UMC Develop Reference Design for Wireless
09/22/05Collaboration and the X Factor
09/09/05Who Sets the Design Rules?
09/08/05Cadence supporting OpenAccess 2.2
09/05/05OpenAccess: first impressions at AMD
09/01/05Case Study: Collaboration Success for Fabless Wireless IC Start-up in China Market
08/29/05Designing ICs with the 'X' Architecture
08/18/05Get Up Close and Personal with Silicon Foundries
07/27/05Cadence, Accent, ARM Improve Low-power Design
07/25/05Multi-voltage Cuts Chip Power by 40%
07/18/05Leaky Chips Test Designers' Skills
06/20/05The search for semiconductor IP intensifies
06/16/05Power Puts Moore's Law in Danger
06/16/05Search for Low Power Continues at DAC
06/15/05Open Modeling Coalition launches at DAC
06/13/05ATI, TSMC, Cadence Move X Architecture Closer to Production
06/13/05Cadence 45ø X-Architecture Gets Cheers from ATI
06/13/05ATI Produces First X Architecture Chip, Says Cadence
06/13/05ATI positive on diagonal routing
06/09/05TSMC releases reference design flow for 65-nm processes
06/08/05Rebuilding Momentum in EDA
04/14/05Low-power Design Techniques Drop 90nm Consumption
04/11/05UMC poised to use X architecture for 90-nm chips
03/01/05Collaborative DFM Critical for Enabling Nanometer Design
02/14/05Designing for Yield Heats Up
02/14/05IEEE SystemVerilog Heads Towards Balloting
02/03/05Experts debate how to leverage design-for-yield
02/03/05Special Market Focus: Collaborative Design, Part Two
01/27/05Special Market Focus: Collaborative Design
01/17/05Open-source Project Looks to Ignite EDA Research
01/01/05Dot.Org-Si2: Innovation Through Collaboration
11/29/04SystemC Presses IEEE Standardization
11/19/04Focus On Results in System Language Debate
10/11/04Methodology Sought For Assertion-based Verification
09/30/04Accellera Re-elects Officers, Cites Progress in IEEE
06/15/04Cadence Promises Full SystemVerilog Support
06/14/04X routing heads for fab
06/09/04Can You Build It?
06/08/04Cadence adds DFM tools to Encounter
06/07/04EDA at a Crossroads over Verilog's Future
06/01/04Accellera reneges on IEEE SystemVerilog transfer
05/27/04Verilog schism feared as Accellera bypasses IEEE 1364
05/14/04EDA vendor, Accellera moves place SystemVerilog at crossroads
02/03/04OpenAccess users cite successes, concerns
01/19/04OpenAccess claims inroads among design EEs
01/19/04CoWare forges a SystemC link for its SPW tool
01/01/04Time Travel to 2029: Nanotechnology Thrives
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