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DESIGN FOR MANUFACTURING
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Cadence design for manufacturing (DFM) technologies enable you to verify and optimize layouts in digital and custom IC designs, while providing a reliable way to achieve manufacturing sign-off before tape-out.
To successfully get nanometer-scale designs to market, semiconductor companies must address a growing array of challenges—from ever-more stringent design rules to increasing chip layout complexity. Designers must also contend with the physical effects that become much more troublesome at these smaller geometries. Lithographical and CMP manufacturing effects can have significant impact on both functional and parametric yield. Process variations across the die, wafer, and batch affect yield, performance, and reliability.

Cadence recognizes these challenges and has created the most comprehensive Design for Manufacturing (DFM) solutions in the industry. Cadence technologies are integrated into design flows to prevent manufacturing effects from impacting digital and custom layouts, analyze systematic and random variability on designs and optimize the design to maximize yield. In minimizing the impact of random and systematic manufacturing effects on functional and parametric yield, Cadence provides designers with the technologies and flows they need to address the industry's most difficult DFM challenges.

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