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Press releases



08/27/07New Kit from Cadence Cuts Risk and Time for Adopting Functional Verification Methodology
07/23/07Jazz Semiconductor Teams with Cadence on Support for Cadence RF and AMS Design Kits
07/11/07Cadence Extends Integrated SiP Technologies Into the Latest Custom And Digital Design Flows
05/14/07Cadence Speeds Adoption of Wireless and Consumer Low-Power Designs with Low-Power Methodology Kit
01/31/07Freescale Uses Cadence Analog Mixed Signal Kit to Speed Up Flow Development
11/09/06Cadence and SMIC Collaborate to Address Wireless Design Challenges in China
07/31/06Amalfi Semiconductor Turns to Cadence Kit to Speed Up Product Development for Cell Phones
06/26/06Cadence and ARM Deliver Innovative Kit to Speed Verification Closure for ARM Processor-Based Designs
06/26/06Cadence Mainstreams System-in-Package Design
05/08/06KPIT Cummins Infosystems Adopts Cadence Analog Mixed Signal Methodology Kit
12/12/05Cadence Delivers New RF Design Kit Targeting Customer Design Challenges in Wireless
09/12/05Cadence Delivers on First Milestone in Kits Strategy
09/12/05ARM and Cadence Optimize Digital SOC Design Through Expanded Collaboration
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Third-party press releases



08/27/07Cadence Selects Wipro-New Logic's Wireless LAN IP for its SoC Functional Verification Kit
08/27/07Cadence Selects Chipidea's USB 2.0 IP For Its SoC Functional Verification Kit
05/15/07Cadence Selects Wipro-New Logic's Wireless LAN IP for its Low-Power Methodology Kit
allthird-party press releases

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