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Home > Products > Allegro IC-PKG-PCB co-design > Design tasks
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Allegro system interconnect design platform design tasks
|  | PCB Design
As printed circuit boards grow in complexity, effective collaboration between design teams becomes paramount to your success. Cadence® offers two integrated, front-to-back design solutions that help you conquer today's difficult PCB design challenges. Our Allegro® PCB Design L series is ideally suited to small- to medium-size teams that require an initial cost-conscious solution—with the flexibility to scale as technology challenges increase. The Allegro PCB Design XL series is a complete solution for advanced high-speed, constraint-driven PCB design. Allegro PCB Design XL series features Allegro Constraint Manager, the only constraint management solution that allows you to manage electrical constraints concurrently across the design flow as one seamless process. | | | High-speed PCB design and analysis
Increasing density, complexity, and faster edge rates mean that designers must address high-speed issues throughout the design process. The era of post-layout analysis—i.e., addressing high-speed issues at the very end—is over. Today, designers need an integrated design environment that addresses high-speed issues—starting at the initial steps of the design cycle and continuing through routing. | | | IC Packaging and Analysis
Ongoing technological breakthroughs and fierce market demands place immense pressure on IC package designers and engineers. With the move to nanometer-scale ICs, chips contain more functionality and are driven to higher performance levels than ever before. At the same time, packaging technology is undergoing rapid change, including the move to multi-layer flip-chip packaging to accommodate 1000+ I/O pins and multiple stacked die systems in package (SiP) as a realistic alternative to SoCs. Such changes are driving the need for a co-design methodology across silicon-package-board as engineers realize that, if optimal device performance and integrity are to be realized, packaging decisions cannot be made independently of the chip and the system. | | | Silicon Design-in
Integrated circuit manufacturers can help shorten their customers' design-in time on complex silicon devices by providing an executable version of their design guides in the form of high-speed silicon design-in kits. These silicon design-in kits work within the Cadence Allegro SI signal design and analysis environment and can save time and reduce costs by allowing PCB design engineers direct use of silicon-level SPICE and behavioral models earlier in the design cycle. |
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