Technical Info

This page contains technical information related to Silicon-package-board co-design, including application notes, white papers, and articles. Here are the latest product promotions.

White papers

	Using intelligent automation in advanced PCB design

	Optimizing the PCB Design Chain and the Role of Library and Design-data Management

	A New Paradigm in Logical Design Creation (Allegro Design Editor)

	On Target, On Time—A Co-Design Methodology for System Interconnect

	Return on Investment—A Co-Design Methodology for System Interconnect

Articles

10/18/07	Ensuring Reliable and Optimal Analog PCB Designs With Advanced Analysis for Spice Simulation

07/31/07	Software Options Captures RF Design Intent

07/10/07	Editor's Choice: Cadence's Allegro System Interconnect Design Platform

03/08/07	Solving PCB Design Interconnect Challenges

02/22/07	Methodology and Flow Challenges in Multi-die Package Design

more articles

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