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Home > Products > System-in-package design > Design tasks > Digital SiP Design
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Digital System-in-package Design
System-in-package (SiP) implementation poses new hurdles for system architects and designers. Increasing the number of IC die not only introduces more overall complexity, but these die sharing the same power grid within a package substrate also makes power delivery and signal integrity more complex. Packing more functionality into a smaller footprint often involves highly complex combinations—such as stacked die, wirebond die stacked on flip-chip die, direct die-to-die attachment, and others—which makes the capture, prototyping and optimization of the SiP's connectivity a major challenge. Additionally, system engineers require a new set of solutions that address the specific challenges involved in integrating signal integrity (SI) analysis, interconnect extraction, and modeling with the physical SiP design environment.
 | Cadence SiP Digital Architect
Gives the architect a unique environment to explore and define system connectivity/functionality that is optimized between ICs, SiP package substrate, and target PCB system through concurrent co-design.
| | Cadence SiP Digital Layout
Provides a constraint- and rules-driven layout environment for SiP design. It includes substrate place and route, final connectivity optimization at the IC, substrate, and system levels, manufacturing preparation, full design validation, and tapeout.
| | Cadence SiP Digital SI
Speeds and streamlines SiP design by providing an environment for the co-design and co-simulation of SiP designs—including embedded ICs and the target PCB. By using its integrated signal integrity, parasitic extraction, integration with an external 3D modeling engine, engineers can make tradeoffs to minimize cost while maximizing performance of the package module interconnect.
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