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Home > Products > System-in-package design > Products > Cadence SiP Digital Architect
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Cadence SIP Digital Architect
System-in-package (SiP) implementation poses new hurdles for system architects and designers. Increasing the number of IC die not only introduces more overall complexity, but these die sharing the same power grid within a package substrate also makes power delivery more complex.
To address these and other challenges, Cadence® SiP Digital Architect provides a unique environment to explore, define, and optimize system connectivity and functionality between ICs, SiP substrates, and target printed circuit board (PCB) systems
Cadence SiP Digital Architect is available in XL and GXL (PDF) offerings.
Key benefits
 | Allows rapid "what-if" feasibility studies for maximum device functional density, performance, and minimal power consumption | | Enables rapid system-level connectivity capture with ability to bind into alternative physical implementation scenarios to evaluate performance and tradeoffs | | Provides IC I/O padring/array co-design and optimization at the IC, substrate, and system levels |
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