Cadence Design Systems, Inc.

Advanced Packaging Design News and Events

This page contains press releases, articles, and events related to Advanced packaging solution.

Press releases

09/12/06	Amkor Selects Cadence Technologies for SiP Design Centers Worldwide

07/17/06	Cadence and TSMC Accelerate 65-Nanometer Design with TSMC Reference Flow 7.0

06/26/06	Cadence Mainstreams System-in-Package Design

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Articles

02/22/07	Methodology and Flow Challenges in Multi-die Package Design