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Cadence solutions
The consumerization of electronics is a driving force for innovation in both semiconductor and system OEM companies to address the demand for functionality convergence. As a result, electronics products today include combinations of complex silicon and software solutions coupled with low-power, low-cost packages and miniature, high-speed printed circuit boards.
This presents tremendous challenges for electronics design teams tasked with developing and delivering these products to market—from growing silicon complexity to IC packages that mix different types of silicon to nanometer-scale electrical effects. The old model of using point design tools to build custom design flows is no longer valid. In fact, the time to build a custom flow can often exceed the time-to-market window for a new or derivative product design.
Design team productivity, product reliability, and schedule predictability are the three variables all companies want to optimize. Today's semiconductor and systems design teams can no longer rely on generic technology or point tools to overcome design productivity and predictability hurdles.
A unique holistic approach
Cadence takes a unique holistic approach to solving the entire design team problem—from specification to verification, implementation, and manufacturing. A set of solutions from Cadence simplifies the adoption and production-flow deployment of EDA technologies within geographically dispersed design teams and among design chain partners.
Our solutions arm design teams with everything they need to get their jobs done effectively— from integrated flows to design chain management to design services—all of which combined reduce quality and functionality risks while improving predictability. In addition, Cadence offers engineering design services to help customers meet their broader business and project goals.
A tuned and tailored set of integrated technologies and flows
Solutions from Cadence are tailored to address specific design needs based on the complexity of the task being performed and the expertise and specialty of the design team performing that task. We combine applicable design technologies with proven methodologies to bring unique solutions to design teams:
 | Low power — the industry's first complete solution integrates logic design, verification, and implementation technology—all enabled with the Si2 Common Power Format (CPF)—to improve productivity, reduce risk, and achieve optimal trade-offs among timing, power, and area | | Logic design — an integrated design and verification environment enables teams to concurrently design with power, test, implementation, and verification in mind. The result is a golden gate-level netlist with the highest quality of silicon (QoS) | | Advanced verification — industry best practices combined with verification process automation and management across block, chip, and system levels address the needs of dedicated verification teams responsible for full-chip and system functional verification and closure | | Digital implementation — an approach that addresses the needs of implementation teams taking designs from golden gate-level netlist through GDSII. It provides the speed, ease-of-use, automation, and silicon accuracy designers need to achieve success with large-scale digital ICs, including low-power and mixed-signal designs as well as design for manufacturing | | Custom design — a unified design environment that blends innovative constraint-driven design capabilities with sophisticated software and flows for simulation, design, layout, verification, silicon analysis, and manufacturing-aware chip finishing of custom analog, RF, and mixed-signal ICs | | PCB design — widest range of fully scalable PCB design technologies ideal for everything from the simplest of boards to the most complex, high-speed designs | | Advanced packaging/SiP — a robust set of capabilities target current and future packaging technologies, including wirebond, perimeter array flip-chip, full array flip-chip, and stacked multi-die packages |
Cadence Engineering Services
The Cadence® Engineering Services offerings are designed to extend our customers' capabilities—for design, methodology, and technology adoption. Our 300+ highly trained engineers have helped more than 200 customers worldwide, spanning all industries, to reach their markets with differentiated silicon solutions.
Cadence Engineering Services specializes in low-power, high-end digital design, advanced RF design, as well as analog and mixed-signal design. We take a collaborative approach with our customers, helping them meet their broader business and project goals with the appropriate choice of flows, design expertise, enabling IP, and partnerships
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