Executive team
Executive Briefing Center
Newsroom
Events and webinars
Investor relations
Success stories and videos
Cadence Research Laboratories
Employment
Community involvement
Cadence worldwide
Cadence advertising gallery
Logos
Print-friendly version

ChipPaC—IC Packaging Design


Bret Zahn
Vice President, Design and Characterization, ChipPAC
Cadence IC Packaging solutions help ChipPAC increase communication and easily pass designs between designers around the world.

RealMedia: Low (35K) | Med (100K) | High (250K)

Related videos
Bill Carlson, Intel
Cadence SPECCTRAQuest helps Intel significantly reduce overall development time for evaluation boards.

Low (35K) | Med (100K) | High (250K)


Tim Jaynes, Xilinx
Using Cadence SPECCTRAQuest, we were able to get a 50% savings in overall board development time.

Low (35K) | Med (100K) | High (250K)


Uday Kapoor, Sun Microsystems
The SPECCTRAQuest™ signal integrity expert suite helps Sun Microsystems eliminate noise in high-speed power delivery systems for PCBs.

Low (35K) | Med (100K) | High (250K)


Martin Goldberg, Siemens
Siemens on PCB Design

Low (35K) | Med (100K) | High (250K)


Video resources